Description
TECBOND 5 is a unique high performance hot melt adhesive.
It is very low in viscosity enabling close bonds to be made, the low viscosity also increases glue gun output, eliminates stringing at the nozzle and allow the adhesive to be run at lower temperatures if required.
The adhesive also features a long open time which is quite unusual for low viscosity hot melts.
Adhesion is exceptional and allows TECBOND 5 to bond many plastics, ceramics, light gauge metals and many soft woods where a close strong joint is important.
