Description
TECBOND 271-PL has been specifically developed to bond polyethylene and polypropylene. It will also bond most other plastics, non-woven materials and fabrics.
It has a good level of both heat and cold resistance.
The best results on polyethylene and polypropylene including best low temperature resistance are achieved when the adhesive is applied, and the bond is made at the highest possible temperature. We would recommend 190°C / 374°F.
Bulk hotmelt tank, can be jetted and spray applied.
Suggested application temperature is 180-190°C / 300-320°F depending on substrates to be bonded.
To prevent adhesive degradation the tank temperature should be reduced to 150-160°C / 300-320°F during idle and standby periods.
