Sealing components with potting and encapsulating compounds prevents corrosion and ensures long-term integrity of a device, but using traditional methods, such as epoxy resins or silicone can prove time consuming, costly and inefficient.
A new manufacturing process has been developed for a black polyamide potting compound that can be dispensed through conventional 12mm (½″) hotmelt glue guns. This process has been specifically designed for the electronics, automotive and aerospace industries.
TECBOND hotmelt adhesive provide instant, permanent bonding on a vast range of materials without the use of harmful solvents. Tec Glue Guns are designed to apply the wide range of TECBOND adhesives, easily, quickly and reliably. They are low-cost capital items, highly portable and designed to be totally reliable in tough industrial environments.
