Description
TECBOND 263 is a very high performance hotmelt specifically designed to bond polypropylene. This unique hotmelt provides excellent heat resistance and good low temperature performance.
To maximize bond strength on Polypropylene it is important that sufficient adhesive is applied between 190-200˚C and the surfaces brought together as quickly as possible. It is strongly recommended that a good quality high output glue gun is used to ensure consistent strong bonds.
Please note TECBOND 263 is specifically designed for bonding polypropylene and is not suitable for bonding other plastics.
