Description
TECBOND 272-PL is a high-performance adhesive for product assembly applications for use on various plastics, foams, fabrics, and non-woven materials. It is also suitable for some polyofin plastics such as polypropylene.
TECBOND 272-PL has an exceptional heat resistance of 105°C / 221°F and cold resistance down to -30°C / -20°F depending on the substrates being bonded.
Bulk hotmelt tank, can be jetted and spray applied.
The best results on polypropylene including best low temperature resistance are achieved when the adhesive is applied, and the bond is made at the highest possible temperature. We would recommend 200°C / 392°F.
Suggested application temperature is 180-200°C / 356-392°F depending on substrates to be bonded.
To prevent adhesive degradation the tank temperature should be reduced to 150-160°C / 300-320°F during idle and standby periods.
