Description
Low melt, fast setting, high performance, white adhesive, suitable for use on expanded polystyrene, thin films and balloons.
TECBOND LM44 is a high-performance adhesive formulated for application at low temperature (130-160˚C).
It is suitable for use on temperature sensitive materials that would be damaged by normal hotmelt temperatures.
The lower application temperature reduces the risk of accidental burns making it suitable for use in schools and for applications that require fingers to be close to the adhesive during assembly.
This is a fast setting adhesive that can be used for box and carton closing.
